OPEN ACCESS CLEANROOM FOR GLASS & SILICON ETCHING OF MICROSTRUCTURED DEVICES
Core Facility
- 300 m² class 100 area
- 250 m² technical area
- State-of-the-art equipment for 100 mm glass and Si wafers
- Located at Etterbeek Campus, Centre of Brussels
- Flexible offices for users
- Accessible with wheelchair
- Capacity of 5-8 FTE
Cleanroom
- All technology available for entire process flows, incl. patterning, etching, bonding and dicing
- Wafer size of 100 mm
- Feature size 1 µm
- Foster multidisciplinary research
- Intensify cooperation with industry
- Focus on microfluidic solutionsfor medical, pharma and biotech applications
State-of-the-art equipment
- Deep reactive ion etching (DRIE) of glass
- DRIE of Si
- Lithography
- Thermal evaporation
- LPCVD furnace
- Plasma cleaning
- Wafer bonding
- Wafer dicing
- Wet benches
- Characterization (SEM, optical microscopes, profilometer, …)